Details of Development
QFN Tape (Masking)
Heat Resistance Masking Tape of QFN & LED PKG Process
No Leakage for EMC Mold Process
Good Wetting & Removal Properties for Cu-L/F & PPF
Good Stability for Wire Bonding & Si-Out Gas
Research Area
- Dicing & Carrier tape for MLCC process
Applicable for Surface Protection of Various Chip
Easily Remove from Adherend without Any Residue
Excellent Adhesion between Adhesive and Adherend
