生産工程用マスキングテープを主力で開発し、多様化する工程に合わせて細分化し、
製品ラインアップを構築及び開発しています
Heat Resistance Masking Tape of QFN & LED PKG Process
No Leakage for EMC Mold Process
Good Wetting & Removal Properties for Cu-L/F & PPF
Good Stability for Wire Bonding & Si-Out Gas
Applicable for Surface Protection of Various Chip
Easily Remove from Adherend without Any Residue
Excellent Adhesion between Adhesive and Adherend