我们主要开发生产工序用Masking tape,根据多元化的工序细分产品进行开发。
Heat Resistance Masking Tape of QFN & LED PKG Process
No Leakage for EMC Mold Process
Good Wetting & Removal Properties for Cu-L/F & PPF
Good Stability for Wire Bonding & Si-Out Gas
Applicable for Surface Protection of Various Chip
Easily Remove from Adherend without Any Residue
Excellent Adhesion between Adhesive and Adherend