생산 공정용 Masking tape를 주력 개발하며, 다변화하는 공정에 맞춰 제품군을 세분화 하여 개발하고 있습니다
Heat Resistance Masking Tape of QFN & LED PKG Process
No Leakage for EMC Mold Process
Good Wetting & Removal Properties for Cu-L/F & PPF
Good Stability for Wire Bonding & Si-Out Gas
Applicable for Surface Protection of Various Chip
Easily Remove from Adherend without Any Residue
Excellent Adhesion between Adhesive and Adherend